Direct Ink Write (DIW) is an additive manufacturing technique that allows for the creation of complex patterns by extruding a viscous material through a syringe, depositing this material onto a substrate; and is used in a variety of applications from biological systems to electronics. The printing process requires materials (or “inks”) with complicated rheological properties, which includes being shear thinning so that it may extrude easily through the syringe, but also exhibit a yield stress once deposited to maintain its shape. Modeling DIW presents many challenges for computational models, which include the highly nonlinear behavior of materials, as well as tracking of the complex material interfaces as the ink is deposited onto the substrate. We simulate the DIW process using unstructured, linear finite-elements to solve the transient, three-dimensional Navier-Stokes equation using a non-Newtonian viscosity model to capture the effects of the complex ink rheology. To track the ink/air/substrate interfaces a sharp interface method is used, known as the conformal decomposition finite-element method (CDFEM). CDFEM is a conformal meshing algorithm that creates sharp boundaries between materials, which allows for the application of boundary conditions such as capillarity and to accurately capture discontinuities in properties such as density or viscosity between materials. In this talk, we will present the results of our simulations of the DIW process for sinusoidal printing patterns. The results of experiments conducted at Lawrence Livermore National Laboratory (LLNL) show some discrepancies between the amplitudes provided to the experimental apparatus and the resulting deposited patterns. We will investigate these discrepancies using our CDFEM modeling framework for both constant and decaying-amplitude sinusoidal printing patterns and give recommendations for improving the accuracy between the expected machine path amplitudes and the resulting experimentally printed patterns. SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525